Semi-automatic pick and place placement machine for Surface Mounted Components (SMT). This machine makes it possible to produce the entire electronic card, from the distribution of solder paste or glue (dispensing) to the precise picking and placement of the various fine-pitch SMT chips and components (SO, FP, BGA package). , etc.).
Contact Task Facility Manager (TFM)
0472448174
Depending structure
Laboratoire Ampère
36, avenue Guy de CollongueBâtiment H9
69134 Ecully Cedex
04 7218 6099
infos : Website
The Laboratory is structured into 3 Scientific Departments :
Electrical Energy (EE): create and optimize devices for transporting, distributing and converting electrical energy, taking into account their environments
Bio-Engineering (BIO): bring out fundamental concepts, methods and applications in bioengineering.
Automation for Systems Engineering (AIS): development of methodologies and tools aimed at optimizing and controlling the dynamic behavior of systems
Keywords :
Electrical Engineering Materials, Power Electronics, High Voltage, Electromagnetic Compatibility, Electromagnetic Modeling, Electrical Energy Storage Systems
Control-command, Mechatronics, Fluid power, Medical robotics, Diagnostics and operating safety
Gene Transfers and Bacterial Adaptation, Ecologi
Other's Laboratory/Plateforme
Laboratory : Packaging & Plastronique 3D
Lab tutorship :
Université de Lyon ; Université Claude Bernard Lyon 1– Ecole Centrale de Lyon – INSA de Lyon – CNRS
21, avenue Jean Capelle
Bât. Léonard de Vinci – 3° étage
69622 Villeurbanne
Continuous education :
Access with light support :
Open to academic :
Open to enterprises :
